An Advanced Cyber Physical Framework for Micro Devices Assembly
本文讨论了工业4.0背景下基于物联网的信息物理框架在微器件装配领域的设计与实现，提出以信息为中心的系统工程方法，并构建了测试平台进行验证。
The design and implementation of an Internet of Things (IoT) based cyber physical framework in the context of Industry 4.0 is discussed for the field of micro devices assembly. Such frameworks hold the potential to facilitate rapid and agile collaborations among distributed engineering partners. This paper outlines the key cyber and physical components which collaborate using cloud-based principles and emerging next generation global environment for network innovation Internet technologies. An information centric systems engineering approach is proposed to help design the cyber physical interactions, which provide a foundation for implementing this cyber physical framework. The cyber modules are capable of assembly planning, path planning, virtual reality-based assembly simulation, and physical command generation. The physical assembly activities are accomplished using micro assembly work cells. An IoT-based cyber physical test bed has been created to test and validate the design and implementation aspects of the proposed framework.