Hierarchical Multiobjective Heuristic for PCB Assembly Optimization in a Beam-Head Surface Mounter
提出一种分层多目标启发式算法，将波束头贴片机的PCB组装优化分解为头任务分配和取放排序两个子问题，按目标重要性依次求解，实现实时最优决策，对高混合低产量生产线有实用价值。
This article proposes a hierarchical multiobjective heuristic (HMOH) to optimize printed-circuit board assembly (PCBA) in a single beam-head surface mounter. The beam-head surface mounter is the core facility in a high-mix and low-volume PCBA line. However, as a large-scale, complex, and multiobjective combinatorial optimization problem, the PCBA optimization of the beam-head surface mounter is still a challenge. This article provides a framework for optimizing all the interrelated objectives, which has not been achieved in the existing studies. A novel decomposition strategy is applied. This helps to closely model the real-world problem as the head task assignment problem (HTAP) and the pickup-and-place sequencing problem (PAPSP). These two models consider all the factors affecting the assembly time, including the number of pickup-and-place (PAP) cycles, nozzle changes, simultaneous pickups, and the PAP distances. Specifically, HTAP consists of the nozzle assignment and component allocation, while PAPSP comprises place allocation, feeder set assignment, and place sequencing problems. Adhering strictly to the lexicographic method, the HMOH solves these subproblems in a descending order of importance of their involved objectives. Exploiting the expert knowledge, each subproblem is solved by an elaborately designed heuristic. Finally, the proposed HMOH realizes the complete and optimal PCBA decision making in real time. Using industrial PCB datasets, the superiority of HMOH is elucidated through comparison with the built-in optimizer of the widely used Samsung SM482.