小样本电迁移测试中BGA试样的退化过程建模与数据驱动寿命预测
Degradation process modeling and data-driven lifetime prediction for BGA specimen during small sample electromigration test
Reliability Engineering and System Safety · 2025
被引 2
ABS 3
- Peixuan Li
- Meilin Wen
- Waichon Lio 通讯
- Yingxia Liu
- Rui Kang
电子封装可靠性退化建模寿命预测电迁移